AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements, AE provides a wide range of dicing environment products: Wafer mounters, wafer cleaners, UV curing systems, dicing tapes and accessories Wafer Mounting: Finished wafers from a semiconductor fab are mounted on dicing tape and attached to dicing frames. Dicing: The frame-mounted wafer is placed in a dicing saw to be cut into individual dies. Cleaning: The diced wafer is placed in a wafer cleaning system to remove debris and micro-particles remaining on the wafer after the dicing process. UV Curing: Wafers that are mounted on UV curable dicing tape undergo a UV curing process to enable easy die removal for pick and place and die attach operations.

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1.Fully Automatic, Continuous Processing Single-cassette Handling System.
2.PC-controlled With Familiar Windows™ Software Interface.
3.Full, On-line Process Monitoring With Dynamic Progress Diagram Display.
4.Low Cost-of-Ownership - Requires No Nitrogen, Exhaust or Cooling Utilities.
5.Safe, Ozone-free UV Irradiation Source.

6.Processes 6”, 8” and 12” Wafer Frames/Cassettes.
7.Economical Footprint 58 x 111 cm.